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STP80NF55L-08 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Lista de partido
STP80NF55L-08
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STP80NF55L-08 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
STP80NF55L-08 - STB80NF55L-08 - STB80NF55L-08-1
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
0.5
Rthj-amb Thermal Resistance Junction-ambient Max
62.5
Tl
Maximum Lead Temperature For Soldering Purpose
300
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
55
Breakdown Voltage
IDSS
Zero Gate Voltage
VDS = Max Rating
1
Drain Current (VGS = 0) VDS = Max Rating, TC = 125 °C
10
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16V
±100
°C/W
°C/W
°C
Unit
V
µA
µA
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250µA
VGS = 10 V, ID = 40 A
VGS = 5 V, ID = 40 A
Min.
1
Typ.
Max.
Unit
1.6
2.5
V
0.0065 0.008
0.008
0.01
DYNAMIC
Symbol
gfs
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS =15V , ID =40 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
150
4350
800
260
Max.
Unit
S
pF
pF
pF
2/9

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