TH3044.2A Ver la hoja de datos (PDF) - Melexis Microelectronic Systems

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TH3044.2A

K-Bus Interface

Melexis Microelectronic Systems  

TH3044

K-Bus Interface

!

Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and

wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC).

The following test methods are applied:

IPC/JEDEC J-STD-020A (issue April 1999)

Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices

CECC00802 (issue 1994)

Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed

Quality

MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding

peak temperature, temperature gradient, temperature profile etc) additional classification and

qualification tests have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding

assurance of adhesive strength between device and board.

For more information on manufacturability/solderability see quality page at our website:

http://www.melexis.com/

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor

products.

3901003044

Rev. 003

Page 11

Nov/02

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