ACT4523(2011) Ver la hoja de datos (PDF) - Active-Semi, Inc
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ACT4523 Datasheet PDF : 15 Pages
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Active-Semi
ACT4523
Rev 4, 21-Jul-11
ORDERING INFORMATION
PART NUMBER OPERATION TEMPERATURE RANGE
ACT4523YH-T
-40°C to 85°C
PACKAGE
SOP-8EP
PINS
8
PACKING
TAPE & REEL
PIN CONFIGURATION
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
1
HSB
High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver.
Connect a 22nF capacitor from HSB pin to SW pin.
2
IN
Power Supply Input. Bypass this pin with a 10µF ceramic capacitor to GND, placed as
close to the IC as possible.
3
SW
Power Switching Output to External Inductor.
Ground. Connect this pin to a large PCB copper area for best heat dissipation. Return
4
GND
FB, COMP, and ISET to this GND, and connect this GND to power GND at a single
point for best noise immunity.
5
FB
Feedback Input. The voltage at this pin is regulated to 0.808V. Connect to the resistor
divider between output and GND to set the output voltage.
6
COMP
Error Amplifier Output. This pin is used to compensate the converter.
Enable Input. EN is pulled up to 5V with a 4μA current, and contains a precise 1.6V
7
EN
logic threshold. Drive this pin to a logic-high or leave unconnected to enable the IC.
Drive to a logic-low to disable the IC and enter shutdown mode.
8
ISET
Output Current Setting Pin. Connect a resistor from ISET to GND to program the
output current.
Exposed Pad
Heat Dissipation Pad. Connect this exposed pad to large ground copper area with
copper and vias.
Innovative PowerTM
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Copyright © 2011 Active-Semi, Inc.
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