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NCP1117DT285RKG(2014) Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Lista de partido
NCP1117DT285RKG
(Rev.:2014)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NCP1117DT285RKG Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
NCP1117, NCV1117
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318H
ISSUE O
E
H
0.2 M C B S
0.08
C
B
3
A
e
2
e1
A
4
B
1
b2
E1
A1
0.1 M C A S B S
A
B
A
(b2)
ÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇ
b3
SECTION B−B
(b)
T c1ÉÉÇÇÉÉÇÇb1 ÉÉÇÇc
L
SECTION A−A
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.
4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
MILLIMETERS
DIM MIN MAX
A --- 1.80
A1 0.02 0.11
b 0.60 0.88
b1 0.60 0.80
b2 2.90 3.10
b3 2.90 3.05
c 0.24 0.35
c1 0.24 0.30
D 6.30 6.70
E 6.70 7.30
E1 3.30 3.70
e
2.30
e1
4.60
L 0.25 ---
T 0 _ 10_
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ Ǔ SCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
16

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