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MAX16935
(Rev.:2014)

36V, 3.5A, 2.2MHz Step-Down Converter with 28µA Quiescent Current

Maxim Integrated 

MAX16935

36V, 3.5A, 2.2MHz Step-Down Converter

with 28µA Quiescent Current

ABSOLUTE MAXIMUM RATINGS

SUP, SUPSW, LX, EN to PGND.............................-0.3V to +42V

SUP to SUPSW......................................................-0.3V to +0.3V

BIAS to AGND..........................................................-0.3V to +6V

SYNCOUT, FOSC, COMP, FSYNC,

PGOOD, FB to AGND......................... -0.3V to (VBIAS + 0.3V)

OUT to PGND.........................................................-0.3V to +12V

BST to LX..................................................................-0.3V to +6V

AGND to PGND....................................................-0.3V to + 0.3V

LX Continuous RMS Current.................................................3.5A

Output Short-Circuit Duration.....................................Continuous

Continuous Power Dissipation (TA = +70NC)*

TSSOP (derate 26.1mW/NC above +70NC).............2088.8mW

Operating Temperature Range......................... -40NC to +125NC

Junction Temperature......................................................+150NC

Storage Temperature Range............................. -65NC to +150NC

Lead Temperature (soldering, 10s).................................+300NC

Soldering Temperature (reflow).......................................+260NC

*As per JEDEC51 standard (multilayer board).

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TSSOP

Junction-to-Ambient Thermal Resistance (BJA)........38.3NC/W

Junction-to-Case Thermal Resistance (BJC)..................3NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2FH, CIN = 4.7FF, COUT = 22FF, CBIAS = 1FF, CBST = 0.1FF, RFOSC = 12kI,

TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)

PARAMETER

Supply Voltage

Load Dump Event Supply

Voltage

Supply Current

Shutdown Supply Current

BIAS Regulator Voltage

BIAS Undervoltage Lockout

BIAS Undervoltage Lockout

Hysteresis

Thermal Shutdown Threshold

Thermal Shutdown Threshold

Hysteresis

OUTPUT VOLTAGE (OUT)

FPWM Mode Output Voltage

SYMBOL

VSUP, VSUPSW

CONDITIONS

VSUP_LD

tLD < 1s

ISUP_STANDBY

ISHDN

VBIAS

VUVBIAS

Standby mode, no load, VOUT = 5V,

VFSYNC = 0V

VEN = 0V

VSUP = VSUPSW = 6V to 42V,

IBIAS = 0 to 10mA

VBIAS rising

VOUT

VFB = VBIAS, 6V < VSUPSW < 36V,

fixed-frequency mode (Notes 2, 3)

MIN TYP MAX UNITS

3.5

36

V

42

V

28

40

FA

5

10

FA

4.7

5

5.4

V

2.95 3.15 3.40

V

450 650

mV

+175

NC

15

NC

4.9

5

5.1

V

Maxim Integrated

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