V360EPC Ver la hoja de datos (PDF) - QuickLogic Corporation

Número de pieza

componentes Descripción

Lista de partido

V360EPC

LOCAL BUS TO PCI BRIDGE FOR DE-MULTIPLEXED A/D PROCESSORS

QuickLogic Corporation 

V360EPC

3.0 DC Specifications

The DC specifications for the PCI bus signals match exactly those given in the PCI Specification, Rev.

2.1, Section 4.2.1.1. For more information on the PCI DC specifications, see the PCI Specification.

Table 6: Absolute Maximum Ratings

Symbol

Parameter

VCC Supply voltage

VIN DC input voltage

IIN DC input current

Tj Junction temperature

TSTG Storage temperature range

Value

Units

-0.3 to +7

V

-0.3 to VCC+0.3

V

± 10

mA

125

°C

-40 to +125

°C

Table 7: Guaranteed Operating Conditions

Symbol

Parameter

VCC Supply voltage 5 volt

VCC Supply voltage 3.3 volt

Theta Ja Thermal resistance

TA Ambient temperature range

Value

4.50 to 5.50

3.0 to 3.6

50

-40 to 85

Units

V

V

°C/w

°C

3.1 PCI Bus DC Specifications

Table 8: PCI Bus Signals DC Operating Specifications

Symbol

Parameter

VIH Input high voltage

VIL Input low voltage

IIH Input high leakage current

IIL Input low leakage current

VOH Output high voltage

VOL Output low voltage

CIN Input pin capacitance

Condition

Min

Max Units Notes

2.0 VCC+0.5 V

-0.5

0.8

V

VIN = 2.7V

70

µA

1

VIN = 0.5V

-70

µA

1

IOUT = -2mA

2.4

V

IOUT = 3mA, 6mA

0.55

V

2

10

pF

3

10

V360EPC Data Sheet Rev 1.2

Copyright © 1998, V3 Semiconductor Inc.

Share Link: