Figure 10: Ordering Information Scheme
ESD Array
Breakdown Voltage
18 = 18 Volts max.
ESDA18-1F2
ESDA 18 - 1 Fx
Number of line
1 = signle line
Package
F = Flip-Chip
x = 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
0.95mm ± 50µm
Figure 12: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
365
240
E
xxz
y ww
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