!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
GR4 Series Specifications and Test Methods
Continued from the preceding page.
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/iÃÌÊiÌ
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12 iviVÌ
No marking defects
b
d
c
ø4.5
a
100
Fig. 2
t : 1.6
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 50 Pressurizing
speed: 1.0mm/s
Pressurize
LZW
iÃÊ®
®
>
L
V
`
4.5Z2.0
3.5
7.0
2.4
4.5Z3.2
3.5
7.0
3.7
1.0
5.7Z5.0
4.5
8.0
5.6
Flexure=1
Capacitance meter
45
45
(in mm)
Fig. 3
13
-`iÀ>LÌÞÊvÊ
/iÀ>Ì
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
««i>À>Vi No marking defects
>«>VÌ>ViÊ
>}i
Within ±10%
D.F.
,iÃÃÌ>ViÊ
14 ÌÊ-`iÀ}Ê I.R.
i>Ì
0.025 max.
More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
UiÀÃ}Êëii`: 25±2.5mm/s
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150Y W100°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
**Ài
i>Ì}
-Ìi«
1
2
/i«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/i
1 min.
1 min.
««i>À>Vi No marking defects
>«>VÌ>ViÊ
>}i
Within ±15%
D.F.
0.05 max.
I.R.
More than 3,000MΩ
15
/i«iÀ>ÌÕÀiÊ
ÞVi
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
-Ìi«
1
2
3
4
/i«iÀ>ÌÕÀiÊc®
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
/iÊ°®
30±3
2 to 3
30±3
2 to 3
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150W Y100°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Glass Epoxy Board
Solder resist
Cu
Fig. 4
««i>À>Vi No marking defects
>«>VÌ>ViÊ
Õ`ÌÞÊ
>}i
Within ±15%
16 -Ìi>`ÞÊ D.F.
0.05 max.
-Ì>Ìi® I.R.
More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500W Y24 0 hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150W Y100°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
163