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HF30ACB2012 Ver la hoja de datos (PDF) - TDK Corporation

Número de pieza
componentes Descripción
Lista de partido
HF30ACB2012
TDK
TDK Corporation TDK
HF30ACB2012 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
EMC Components
Chip beads
For general signal line
(3/8)
Product compatible with RoHS directive
Halogen-free
Compatible with lead-free solders
Overview of HFxxACB2012 type
FEATURES
Noise reduction solution for general signal line.
Achieves various frequency characteristics by using 3 materials with different features.
There is no directivity.
APPLICATION
Signal line noise removal for DSCs, DVCs, PCs, TVs, printers, game machines, smart grids, wireless base stations, industrial equipment.
PART NUMBER CONSTRUCTION
HF70 ACB
201209 -
T
Material name
HF70
HF50
HF30
Series name
L×W×T dimensions
(mm)
201209 2.0×1.25×0.9
Packaging style
T
Taping
OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT
Temperature ranges
Type
Operating
temperature
Storage
temperature
HFxxACB2012
°C
–40 to +125
°C
–40 to +125
The storage temperature range is for after the circuit board is mounted.
Package quantity Individual weight
(pieces/reel)
2,000
mg
10
RoHS Directive Compliant Product: See the following for more details.https://product.tdk.com/info/en/environment/rohs/index.html
Halogen-free: indicates that Cl content is less than 900ppm, Br content is less than 900ppm, and that the total Cl and Br content is less than 1500ppm.
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
20160722 / beads_commercial_signal_hfxxacb2012_en.fm

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