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C0202 Ver la hoja de datos (PDF) - Unspecified

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C0202 Datasheet PDF : 2 Pages
1 2
Wire Bondable
Chip Capacitor
WBC Capacitor Series
Silicon Dioxide/Silicon Nitride dielectric
Capacitance range from 10pF to 1000pF
Silicon substrate with gold or aluminum backing
IRC’s wire-bondable chip capacitors are based on the successful
TaNCAP® line of RC networks on silicon. The new chip capacitors have
the advantage of excellent performance in extremely small sizes ranging from
20 to 60 mils square.
Capacitors are 100% electrically tested with mil screening to MIL-STD-883 also available.
For demanding hybrid circuit and/or chip and wire applications, specify IRC’s WBC capacitor series.
Physical Data
C0404
Top Bonding Pad
C0606
Top Bonding Pad
C0303
Back of chip
C0202
Back of chip
C0505
Manufacturing Capabilities Data
Style
C0202
C0303
C0404
C0505
C0606
Size
0.020± 0.001 sq.
(0.508mm ±0.025)
0.030± 0.001 sq.
(0.762mm ±0.025)
0.040± 0.001 sq.
(1.016mm ±0.025)
0.055± 0.001 sq.
(1.397mm ±0.025)
0.060± 0.001 sq.
(1.524mm ±0.025)
Capacitance Range
10pF to 51pF
33pF to 100pF
56pF to 220pF
160pF to 360pF
160pF to 1000pF
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Voltage
40
55
50
20
20
A subsidiary of
TT electronics plc
WBC Capacitor Series Issue January 2009 Sheet 1 of 2

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