RT9193 Ver la hoja de datos (PDF) - Richtek Technology

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RT9193

300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator

Richtek Technology 

For recommended operating conditions specification of

RT9193, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (θJA is layout dependent) for SOT-23-5 package

is 250°C/W, SC-70-5 package is 333°C/W and WDFN-6L

2x2 package is 165°C/W on standard JEDEC 51-3 thermal

test board. The maximum power dissipation at TA = 25°C

can be calculated by following formula :

PD(MAX) = (125°C−25°C) / 333 = 300mW (SC-70-5)

PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT-23-5)

PD(MAX) = (125°C−25°C) / 165 = 606mW (WDFN-6L 2x2)

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA. For RT9193 packages, the Figure 2 of

derating curves allows the designer to see the effect of

rising ambient temperature on the maximum power

allowed.

700

WDFN-6L 2x2

600

500

SOT-23-5

400

SC 70-5

300

200

100

0

0

25

50

75

100 125 150

Ambient Temperature (°C)

Figure 2. Derating Curve for Packages

DS9193-09 March 2007

RT9193

www.richtek.com

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