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CMX602BE4 Ver la hoja de datos (PDF) - CML Microsystems Plc

Número de pieza
componentes Descripción
Lista de partido
CMX602BE4 Datasheet PDF : 23 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Calling Line Identifier
CMX602B
Section
CONTENTS
Page
1.1 Brief Description ............................................................................... 1
1.2 Block Diagram.................................................................................... 3
1.3 Signal List ............................................................................................ 4
1.4 External Components ..................................................................... 6
1.5 General Description ......................................................................... 7
1.5.1 Mode Control Logic ................................................................... 7
1.5.2 Input Signal Amplifier ................................................................ 7
1.5.3 Bandpass Filter .......................................................................... 8
1.5.4 Level Detector ............................................................................ 8
1.5.5 FSK Demodulator....................................................................... 9
1.5.6 FSK Data Retiming..................................................................... 9
1.5.7 Tone Alert Detector.................................................................. 10
1.5.8 Ring or Line Polarity Reversal Detector ................................ 11
1.5.9 Xtal Osc and Clock Dividers ................................................... 13
1.6 Application Notes ........................................................................... 14
1.6.1 'On-Hook' Operation ................................................................ 14
1.6.2 'Off-Hook' Operation ................................................................ 17
1.7 Performance Specification ......................................................... 19
1.7.1 Electrical Performance ............................................................ 19
1.7.2 Packaging ................................................................................. 23
2003 CML Microsystems Plc
2
D/602B/2

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