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UPA101B

COMPOUND TRANSISTOR

NEC => Renesas Technology 

µPA101

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).

(3) Design circuits connected Subpin to the lowest voltage to prevent latch-up.

(4) Design circuits as each pin voltage difference within 15 V maximum.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions

than the recommended conditions are to be consulted with our sales representatives.

µPA101G

Soldering process

Infrared ray reflow

VPS

Wave soldering

Pin part heating

Soldering conditions

Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C),

Time: 2 times, Limited days: no.Note

Package peak temperature: 215 °C, Hour: within 40 s. (more than 200 °C),

Time: 2 times, Limited days: no.Note

Soldering tub temperature: less than 260 °C, Hour: within 10 s.

Time: 1 time, Limited days: no.Note

Pin area temperature: less than 300 °C, Hour: within 3 s./pin

Limited days: no.Note

Recommended

condition symbol

IR35-00-2

VP15-00-2

WS60-00-1

µPA101B

Soldering process

Infrared ray reflow

Partial heating method

Soldering conditions

Peak package’s surface temperature: 230 °C or below,

Reflow time: 10 seconds or below (210 °C or higher),

Number of reflow process: 1, Exposure limit*: None

Terminal temperature: 260 °C or below,

Flow time: 10 seconds or below,

Exposure limit*: None

Symbol

Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.

Caution The combined use of soldering method is to be avoided (However, except the pin area heating

method).

For details of recommended soldering conditions for surface mounting, refer to information

document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P10706EJ2V0DS00

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