PBSS301NZ Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Lista de partido
PBSS301NZ Datasheet PDF : 14 Pages
| |||
NXP Semiconductors
11. Soldering
PBSS301NZ
12 V, 5.8 A NPN low VCEsat (BISS) transistor
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1
2
3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
Fig 16. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
PBSS301NZ_2
Product data sheet
1.9
4
6.2
8.7
1
2
3
1.9
(3×)
2.7
2.7
1.1
1.9
(2×)
Fig 17. Wave soldering footprint SOT223 (SC-73)
Rev. 02 — 17 November 2009
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
© NXP B.V. 2009. All rights reserved.
11 of 14
Share Link: 