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5962F9563202VXC

Radiation Hardened Quad Differential Line Drivers

Intersil 

HS-26CT31RH, HS-26CT31EH

Die Characteristics

DIE DIMENSIONS:

96.5 milx195 milsx21 mils

(2450x4950)

INTERFACE MATERIALS:

Glassivation:

Type: PSG (Phosphorus Silicon Glass)

Thickness: 10kÅ ± 1kÅ

Metallization:

M1: Mo/TiW

Thickness: 5800Å

M2: Al/Si/Cu (Top)

Thickness: 10kÅ ±1kÅ

Substrate:

AVLSI1RA

Backside Finish:

Silicon

ASSEMBLY RELATED INFORMATION:

Substrate Potential (Powered Up):

VDD

ADDITIONAL INFORMATION:

Worst Case Current Density:

<2.0x105A/cm2

Bond Pad Size:

110µmx100µm

3

FN2929.4

February 23, 2012

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