5962-9318709H4X Ver la hoja de datos (PDF) - Microsemi Corporation
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5962-9318709H4X Datasheet PDF : 9 Pages
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WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)
• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package
502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
• 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm
(0.200") high, (Package 528)
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
Commercial, Industrial and Military Temperature Ranges
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX1 - 20 grams typical
Devices are upgradeable to 512Kx32
This product is subject to change without notice.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
12
23
34
45
56
I/O8
WE2# I/O15
I/O24
VCC
I/O31
I/O9
CS2# I/O14
I/O25
CS4#
I/O30
I/O10
GND
I/O13
I/O26 WE4#
I/O29
A13
I/O11
I/O12
A6
I/O27
I/O28
A14
A10
OE#
A7
A3
A0
A15
A11
NC
NC
A4
A1
A16
A12
WE1#
A8
A5
A2
NC
VCC
I/O7
A9 WE3#
I/O23
I/O0
CS1# I/O6
I/O16
CS3#
I/O22
I/O1
NC
I/O5
I/O17
GND
I/O21
I/O2
I/O3
I/O4
11
22
33
I/O18
I/O19
I/O20
44
55
66
Pin Description
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
VCC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
OE#
A0-16
Block Diagram
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
128K x 8
128K x 8
128K x 8
WE#4 CS#4
128K x 8
8
I/O 0-7
8
I/O 8-15
8
I/O 16-23
8
I/O 24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
September 2010 © 2010 Microsemi Corporation. All rights reserved.
1
Rev. 18
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com
www.microsemi.com
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