5962-9318705H4X Ver la hoja de datos (PDF) - Microsemi Corporation
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5962-9318705H4X Datasheet PDF : 9 Pages
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ORDERING INFORMATION
WS128K32-XXX
W S 128K32 X - XXX X X X
White Electronic Designs Corporation
(Microsemi corporation)
SRAM
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power*
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40 mm Low Profile CQFP (Package 502)
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
Note 1: Package Not Recommended For New Designs
* Low Power Data Retention only available in G2U, G2L, PackageTypes
Microsemi Corporation reserves the right to change products or specifications without notice.
September 2010 © 2010 Microsemi Corporation. All rights reserved.
8
Rev. 18
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com
www.microsemi.com
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