datasheetbank_Logo
búsqueda de Hoja de datos y gratuito Fichas de descarga

IRFU4105Z Ver la hoja de datos (PDF) - Kersemi Electronic Co., Ltd.

Número de pieza
componentes Descripción
Lista de partido
IRFU4105Z
KERSEMI
Kersemi Electronic Co., Ltd. KERSEMI
IRFU4105Z Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
IRFR4105Z
IRFU4105Z
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
G
Description
Specifically designed for Automotive applications, thi
MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an extremely
efficient and reliable device for use in Automotive applications and
a wide variety of other applications.
D
VDSS = 55V
RDS(on) = 24.5m
ID = 30A
S
D-Pak
IRFR4105Z
I-Pak
IRFU4105Z
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
™ ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
IDM
Pulsed Drain Current
PD @TC = 25°C Power Dissipation
Linear Derating Factor
VGS
Gate-to-Source Voltage
d EAS (Thermally limited) Single Pulse Avalanche Energy
h EAS (Tested ) Single Pulse Avalanche Energy Tested Value
Ù IAR
Avalanche Current
g EAR
Repetitive Avalanche Energy
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Parameter
RθJC
RθJA
i Junction-to-Case
Junction-to-Ambient (PCB mount)
RθJA
Junction-to-Ambient
Max.
30
21
120
48
0.32
± 20
29
46
See Fig.12a, 12b, 15, 16
-55 to + 175
300 (1.6mm from case )
y y 10 lbf in (1.1N m)
Typ.
–––
–––
–––
Max.
3.12
40
110
Units
A
W
W/°C
V
mJ
A
mJ
°C
Units
°C/W
2014-8-15
1
www.kersemi.com

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]