HCC4030BDG Ver la hoja de datos (PDF) - STMicroelectronics
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HCC4030BDG Datasheet PDF : 34 Pages
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Package information
HCC40xxx, HCC45xxx
5.5
Ceramic Flat-24 package information
Figure 7. Ceramic Flat-24 package outline
18/34
1. The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package.
Connecting unused pins or metal lid to ground or to the power supply does not affect the electrical
characteristics.
Table 11. Ceramic Flat-24 mechanical data
Dimensions
Ref
Millimeters
Inches(1)
Min
Typ
Max
A
10.70
11.00
11.30
B
15.30
15.49
15.70
C
1.45
1.90
D
0.23
0.254
0.30
E
13.84
13.97
14.10
F
1.22
1.27
G
0.45
0.508
H
7.25
L
25.00
M
0.45
0.508
N
7.01
1.32
0.55
8.25
28.00
0.55
1. Values in inches are rounded to three decimal digits.
Min
0.421
0.602
0.057
0.009
0.545
0.048
0.018
0.285
0.984
0.018
Typ
0.433
0.610
0.010
0.550
0.050
0.020
0.020
0.276
Max
0.445
0.618
0.075
0.012
0.555
0.052
0.022
0.325
1.102
0.022
DocID17102 Rev 7
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