FSA2567MPX Ver la hoja de datos (PDF) - ON Semiconductor

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FSA2567MPX

Low-Power, Dual SIM Card Analog Switch

ON Semiconductor 

Physical Dimensions

0.05 C

2X

1.80

AB

2.60

PIN#1 IDENT

TOP VIEW

0.05 C

2X

0.10 C 0.50±0.05

0.15±0.05

0.08 C

0.025±0.025

SEATING C

PLANE

SIDE VIEW

1.80±0.05

5

0.40±0.05 (15X)

DETAIL A

1

PIN#1 IDENT

9

0.40

2.60±0.05

16

13

0.20±0.05 (16X)

BOTTOM VIEW

NOTES:

0.10 C A B

0.05 C

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 2009.

D. LAND PATTERN RECOMMENDATION IS

EXISTING INDUSTRY LAND PATTERN.

E. DRAWING FILENAME: MKT-UMLP16Arev5.

F. TERMINAL SHAPE MAY VARY ACCORDING

TO PACKAGE SUPPLIER, SEE TERMINAL

SHAPE VARIANTS.

0.663

2.10

1

0.40

0.563 (15X)

2.90

0.225 (16X)

RECOMMENDED

LAND PATTERN

0.50±0.05

0.20±0.05

45°

DETAIL A

SCALE : 2X

LEAD SHAPE AT PACKAGE EDGE

R0.20

PACKAGE

EDGE

LEAD

LEAD

OPTION 1 OPTION 2

SCALE : 2X SCALE : 2X

Figure 21. 16-Lead Ultrathin Molded Leadless Package (UMLP)

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