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STM1061 Ver la hoja de datos (PDF) - STMicroelectronics

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STM1061
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STM1061 Datasheet PDF : 21 Pages
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STM1061
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings” table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating con-
ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Table 3. Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
TSTG
Storage Temperature (VCC Off, VBAT Off)
–55 to 150
°C
TSLD(1)
Lead Solder Temperature for 10 seconds
260
°C
VIO
Input or Output Voltage
–0.3 to VCC +0.3
V
VCC
Supply Voltage
0.7 to 6.0
V
IO
Output Current
20
mA
PD
Power Dissipation
320
mW
Note: 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150
seconds).
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