HT1627 Ver la hoja de datos (PDF) - Holtek Semiconductor

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fabricante

HT1627

RAM Mapping 64
16 LCD Controller for I/O μC

Holtek Semiconductor 

HT1627

Pad Description

Pad No. Pad Name I/O

Description

1

DATA

I/O Serial data input/output with pull-high resistor

2

VSS

¾ Negative power supply, Ground

3

OSCI

I

If the system clock comes from an external clock source, the ex-

ternal clock source should be connected to the OSCI pad.

4

VDD

¾ Positive power supply

5

VLCD

I LCD operating voltage input pad.

6

IRQ

O

Time base or Watchdog Timer overflow flag, NMOS open drain

output

7, 8

BZ, BZ

O

2kHz or 4kHz tone frequency output pair (Tri-state output

buffer)

9~12 T1~T4

I Not connected

13~28 COM0~COM15 O LCD common outputs

29~92 SEG0~SEG63 O LCD segment outputs

93

CS

Chip selection input with pull-high resistor. When the CS is

logic high, the data and command read from or write to the

I

HT1627 are disabled. The serial interface circuit is also reset.

But if the CS is at logic low level and is input to the CS pad, the

data and command transmission between the host controller

and the HT1627 are all enabled.

94

RD

READ clock input with pull-high resistor. Data in the RAM of

I

the HT1627 are clocked out on the rising edge of the RD signal.

The clocked out data will appear on the data line. The host con-

troller can use the next falling edge to latch the clocked out data.

95

WR

WRITE clock input with pull-high resistor. Data on the DATA

I line are latched into the HT1627 on the rising edge of the WR

signal.

Absolute Maximum Ratings

Supply Voltage..............................-0.3V to 5.5V

Input Voltage ................VSS-0.3V to VDD+0.3V

Storage Temperature.................-50°C to 125°C

Operating Temperature ..............-25°C to 75°C

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-

mum Ratings² may cause substantial damage to the device. Functional operation of this de-

vice at other conditions beyond those listed in the specification is not implied and prolonged

exposure to extreme conditions may affect device reliability.

5

April 21, 2000

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