T591V227M2R5ATE009(2016) Ver la hoja de datos (PDF) - KEMET

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T591V227M2R5ATE009
(Rev.:2016)

T591/T598 High Humidity/High Temperature Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC

KEMET 

KEMET Organic Capacitor (KO-CAP®) – Automotive Grade

T591/T598 High Humidity/High Temperature Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC

Soldering Process

KEMET’s families of surface mount capacitors are

compatible with wave (single or dual), convection, IR,

or vapor phase reflow techniques. Preheating of these

components is recommended to avoid extreme thermal

stress. KEMET's recommended profile conditions for

convection and IR reflow reflect the profile conditions of the

IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three reflow

passes at these conditions.

Please note that although the X/7343–43 case size can

withstand wave soldering, the tall profile (4.3 mm maximum)

dictates care in wave process development.

Profile Feature SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (TSmin)

100°C

Temperature Maximum (TSmax)

150°C

Time (ts) from Tsmin to Tsmax)

60 – 120 seconds

Ramp-up Rate (TL to TP) 3°C/seconds maximum

Liquidous Temperature (TL)

183°C

Time Above Liquidous (tL)

Peak Temperature (TP)

60 – 150 seconds

220°C*

235°C**

Time within 5°C of Maximum

Peak Temperature (tP)

20 seconds maximum

Ramp-down Rate (TP to TL) 6°C/seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

150°C

200°C

60 – 120 seconds

3°C/seconds maximum

217°C

60 – 150 seconds

250°C*

260°C**

30 seconds maximum

6°C/seconds maximum

8 minutes maximum

Hand soldering should be performed with care due to the

difficulty in process control. If performed, care should be

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad,

applying solder between the pad and the termination, until

reflow occurs. Once reflow occurs, the iron should be

removed immediately. “Wiping” the edges of a chip and

heating the top surface is not recommended.

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

TP Maximum Ramp Up Rate = 3ºC/sec

tP

Maximum Ramp Down Rate = 6ºC/sec

TL

tL

Tsmax

Tsmin

ts

25

25ºC to Peak

Time

Storage

All KO-Cap Series are shipped in moisture barrier bags (MBBs) with desiccant and humidity indicator card (HIC).

These parts are classified as MSL3 (Moisture Sensitivity Level 3) per IPC/JEDEC J-STD-020 and packaged per

IPC/JEDEC J–STD–033

MSL3 specifies a floor time of 168H at 30ºC maximum temperature and 60% relative humidity

Unused capacitors should be sealed in a MBB with fresh desiccant.

Calculated shelf life in sealed bag:

– 12 months from bag seal date in a storage environment of <40ºC and humidity <90% RH

– 24 months from bag seal date in a storage environment of <30ºC and humidity <70% RH

If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2073_T591_T598 • 9/16/2016 11

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