VMMK-2503-BLKG Ver la hoja de datos (PDF) - Avago Technologies
Número de pieza
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VMMK-2503-BLKG Datasheet PDF : 11 Pages
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Outline Drawing
PIN ONE INDICATOR
1.004 MIN, 1.085 MAX
0.125
0.125
0.500 MIN, 0.585 MAX
GROUND PAD
0.470
0.160
0.390
INPUT PAD
Notes:
Solderable area of the device shown in yellow.
Dimensions in mm.
Tolerance ± 0.015 mm
OUTPUT PAD
0.160
Suggested PCB Material and Land Pattern
fy the device
rial with one
tal. Soldering
sion than FR5
materials with
ge of the base
evice circuitry
GaAs package
to damaging
s RO4003 and
al and should
1.2 (0.048)
0.400 (0.016)
0.100 (0.004)
0.500 (0.020)
Part of
Input
Circuit
0.200
(0.008)
0.200
(0.008)
0.100 (0.004)
0.500 (0.020)
Part of
Output
Circuit
0.7 (0.028)
ng
source leads
leads of the
unt. The rec-
ern is shown
ned footprint
t borders the
en.
re any plated
ng and tests
hin .003”) and
ure 5 provides
VMMK-3XXX
kness RO4350
e also applies
t frequencies
-1XXX FETs at
ductance may
may be placed
bility. Consult
ation.
of the VMMK
that the VIAs
om under the
of the VIAs is
e VIAs should
0.076 max
(0.003) 2pl -
see discussion
0.381 (0.015) 2pl
0.254 dia PTH
(0.010) 4pl
Solder Mask
0.400 dia
(0.016) 4pl
NFoigtuerse:5. Recommended PCB layout for VMMK devices
1. 0.010” Rogers RO4350
As a general rule, if a VIA is within .004” (100u) of the edge
of the soldermask but not under the device, then the VIA
should be filled. Any VIA which is covered by the solder
mask and is beyond .004” (100u) of the solder mask edge
can be uncapped and unfilled as it is not at risk of wicking
away solder from the device.
If for any reason it is required to include a VIA or VIAs
under a VMMK device, then the VIAs should be filled and
capped. A capped VIA is a “plated over” filled VIA. If a filled
but uncapped VIA is placed under the device, there will
not be enough solderable surface area for device attach-
ment. If an unfilled and uncapped VIA is placed directly
under the ground pad, then the liquid solder will flow
into the open VIA hole during the reflow process and
deplete the solder volume to varying degrees from
under the ground pad. Depletion of the solder volume
9due to unfilled VIAs may lead to a weak solder joint, poor
grounding of the device, and/or stresses compromising
the structural integrity of the package.
The recommended footprint provides a solder joint
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
from topside if using a vacuum collet.
3. Recommended attachment is solder paste. Please
see recommended solder reflow profile. Conductive
epoxy is not recommended. Hand soldering is not
recommended.
4. Apply solder paste using either a stencil printer or
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade RF
performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp to avoid damage
due to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 to 40 sec. Verify that the
profile will not expose device beyond these limits.
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
Allow the module to dry before testing.
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