CY23S08(2004) Ver la hoja de datos (PDF) - Cypress Semiconductor
Número de pieza
componentes Descripción
Lista de partido
CY23S08 Datasheet PDF : 8 Pages
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PRELIMINARY
CY23S08
Ordering Information
Ordering Code
CY23S08SC–1
CY23S08SC–1T
CY23S08SC–1H
CY23S08SC–1HT
CY23S08ZC–1H
CY23S08ZC–1HT
CY23S08SC–2
CY23S08SC–2T
CY23S08SC–2H
CY23S08SC–2HT
CY23S08SC–3
CY23S08SC–3T
CY23S08SC–4
CY23S08SC–4T
Package Name
S16
S16
S16
S16
Z16
Z16
S16
S16
S16
S16
S16
S16
S16
S16
Package Type
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
16-pin 150-mil TSSOP
16-pin 150-mil TSSOP–Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
16-pin 150-mil SOIC
16-pin 150-mil SOIC–Tape and Reel
Operating Range
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Package Drawings and Dimensions
16-Lead (150-Mil) SOIC S16
PIN 1 ID
8
1
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
9
16
SZ16.15 LEAD FREE PKG.
MAX.
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.0138[0.350]
0.0192[0.487]
SEATING PLANE
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
0° ~8°
0.010[0.254] X 45°
0.016[0.406]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
Document #: 38-07265 Rev. *D
Page 6 of 8
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