ADP1879(RevA) Ver la hoja de datos (PDF) - Analog Devices

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ADP1879
(Rev.:RevA)

Synchronous Buck Controller with Constant On Time and Valley Current Mode

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

VREG to PGND, GND

VIN, EN, PGOOD to PGND

FB, COMP, RES, SS to GND

DRVL to PGND

SW to PGND

BST to SW

BST to PGND

DRVH to SW

PGND to GND

PGOOD Input Current

θJA (14-Lead LFCSP_WD)

4-Layer Board

Operating Junction Temperature Range

Storage Temperature Range

Soldering Conditions

Maximum Soldering Lead Temperature

(10 sec)

Rating

−0.3 V to +6 V

−0.3 V to +28 V

−0.3 V to (VREG + 0.3 V)

−0.3 V to (VREG + 0.3 V)

−2.0 V to +28 V

−0.6 V to (VREG + 0.3 V)

−0.3 V to +28 V

−0.3 V to VREG

±0.3 V

35 mA

30°C/W

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

300°C

Stresses a bove those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to PGND.

ADP1878/ADP1879

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Boundary Condition

In determining the values given in Table 2 and Table 3, natural

convection is used to transfer heat to a 4-layer evaluation board.

Table 3. Thermal Resistance

Package Type

θJA (14-Lead LFCSP_WD)

4-Layer Board

θJA

Unit

30

°C/W

ESD CAUTION

Rev. A | Page 5 of 40

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