USB97CFDC2-MV-01X Ver la hoja de datos (PDF) - SMSC -> Microchip
Número de pieza
componentes Descripción
Lista de partido
USB97CFDC2-MV-01X Datasheet PDF : 24 Pages
| |||
11 MECHANICAL OUTLINE
FIGURE 9 - 100 PIN TQFP PACKAGE
MIN
NOMINAL
MAX
REMARK
A
~
~
1.60
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
1.35
1.40
1.45
Body Thickness
D
13.80
D/2
6.90
D1
11.80
14.00
7.00
12.00
14.20
7.10
12.20
X Span
1/2 X Span Measure from Centerline
X body Size
E
13.80
E/2
6.90
E1
11.80
14.00
7.00
12.00
14.20
7.10
12.20
Y Span
1/2 Y Span Measure from Centerline
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length from Centerline
L1
~
1.00
~
Lead Length
e
0.40 Basic
Lead Pitch
θ
0o
3.5o
7o
Lead Foot Angle
W
0.13
0.16
0.23
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Note 1: Controlling Unit: millimeter
Note 2: Minimum space between protrusion and an adjacent lead is .007 mm.
Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm
Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DS – USB97CFDC2-01
Page 24
DATASHEET
Rev. 02-27-07
Share Link: 