MC74HC367ADG Ver la hoja de datos (PDF) - ON Semiconductor
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MC74HC367ADG Datasheet PDF : 7 Pages
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MC74HC367A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
Vin DC Input Voltage (Referenced to GND)
−0.5 to VCC + 0.5 V
Vout DC Output Voltage (Referenced to GND)
−0.5 to VCC + 0.5 V
Iin
DC Input Current, per Pin
±20
mA
Iout DC Output Current, per Pin
±25
mA
ICC DC Supply Current, VCC and GND Pins
±50
mA
PD Power Dissipation in Still Air,
SOIC Package
500
mW
TSSOP Package
450
Tstg Storage Temperature
−65 to + 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
VCC DC Supply Voltage (Referenced to GND)
2.0
Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND) 0
TA
Operating Temperature, All Package Types
−55
tr, tf
Input Rise and Fall Time
(Figure 2)
VCC = 2.0 V 0
VCC = 3.0 V 0
VCC = 4.5 V 0
VCC = 6.0 V 0
Max Unit
6.0 V
VCC
V
+125 °C
1000 ns
600
500
400
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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