GL6ZS27 Ver la hoja de datos (PDF) - Sharp Electronics

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GL6ZS27

DEVICE SPECIFICATION FOR Light Emitting Diode

Sharp Electronics 

DG996047

MODEL No.

GL6ZS27

Jud16/99

PAGE

g/10

7. Precautionsfor use

7 - 1. Lead forming method

Avoid forming a lead pin with the lead pin base as

a fulcrum:be sure to hold a lead pin firmly when

forming. Lead pins should be formed before soldering.

7 - 2. Notice of installation

7-2-l installation on a P W B

Whenmounting an LEDlamp on a PW,do not apply

physical stress to the lead pins.

l The lead pin pitch should match the PWEp!in-hole

pitch:absolutely avoid widening or narrowing

the lead pins.

l ‘Jhen positioning an LED lampbasically employ

an LED with tie-bar cut or use a spacer.

7-2-2 Whenan LED1 is mounted directly on a PWB

If the bottom face of an LED lamp is mounted

directly on single-sided PWB,thebase of the

lead pins may be subjected to physical stress

due to PWBwarpcutting or clinching of lead

pins. Prior to use, be sure to check that no

disconnection inside of the resin or damageto

resin etc., is found Then an LED lamp is mounted

on a double-sided PWB,theheat during soldering

affects the resin;therefore,keep the LED lamp

more that 1.6mmafloat above the P!B.

7-2-3 Installation using a holder

During an LED lamp positioning,when a holder is

used,a holder should be designed not to subject

lead pins to any undue stress.

(Note)Pay attention to the thermal expansion coefficient

of the material used for the holder.Since the

holder expands and contracts due to preheat and

soldering heat, mechanical stress may be applied to

the lead pins, resulting in disconnection.

7-Z-4 Installation to the case

Do not fix part C with adhesives when fixed to the

case as shown in Figure.A hole of the case should

be designed not to subject the inside of resin

to any undue stress.

Hold I lead pin firmly

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