TGA4513-CP Ver la hoja de datos (PDF) - TriQuint Semiconductor
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TGA4513-CP Datasheet PDF : 10 Pages
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Advance Product Information
March 15, 2005
TGA4513-CP
Assembly of a TGA4513-CP into a Module
Manual Assembly for Prototypes
1. Clean the module with Acetone. Rinse with alcohol and DI water. Allow the module to fully dry.
2. To improve the thermal and RF performance, we recommend attaching a heatsink to the bottom of the
package. If the TGA4513-CP is mounted to the heatsink with mounting screws, we recommend an indium
shim or other compliant material be inserted between the TGA4513-CP and the heatsink to reduce thermal
contact resistance due to air gaps. The TGA4513-CP may also be attached to the heatsink using SN63
solder or any other Tin/Lead solder. The TGA4513-CP may also be mounted with DieMat DM6030HK
conductive epoxy.
3. The DC and RF interconnects may be gold bondwires or gold ribbons. The RF interconnects should be
as short as possible. A minimum of two 1 mil wires are recommended for the RF Input, RF Output, Vg, and
four 1 mil bond wires for Vd.
PART
TGA4513-CP
ORDERING INFORMATION
PACKAGE STYLE
CARRIER PLATE, LEAD FREE
10
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com Info: info-mmw@tqs.com
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