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76132SK8 Datasheet PDF : 11 Pages
First Prev 11
SPICE Thermal Model
REV April 1999
HUF76132SK8
Copper Area = 0.04 in2
CTHERM1 th 8 2.0e-3
CTHERM2 8 7 5.0e-3
CTHERM3 7 6 1.0e-2
CTHERM4 6 5 4.0e-2
CTHERM5 5 4 9.0e-2
CTHERM6 4 3 1.2e-1
CTHERM7 3 2 0.5
CTHERM8 2 tl 1.3
RTHERM1 th 8 0.1
RTHERM2 8 7 0.5
RTHERM3 7 6 1.0
RTHERM4 6 5 5.0
RTHERM5 5 4 8.0
RTHERM6 4 3 26
RTHERM7 3 2 39
RTHERM8 2 tl 55
SABER Thermal Model
Copper Area = 0.04 in2
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 8 = 2.0e-3
ctherm.ctherm2 8 7 = 5.0e-3
ctherm.ctherm3 7 6 = 1.0e-2
ctherm.ctherm4 6 5 = 4.0e-2
ctherm.ctherm5 5 4 = 9.0e-2
ctherm.ctherm6 4 3 = 1.2e-1
ctherm.ctherm7 3 2 = 0.5
ctherm.ctherm8 2 tl = 1.3
rtherm.rtherm1 th 8 = 0.1
rtherm.rtherm2 8 7 = 0.5
rtherm.rtherm3 7 6 = 1.0
rtherm.rtherm4 6 5 = 5.0
rtherm.rtherm5 5 4 = 8.0
rtherm.rtherm6 4 3 = 26
rtherm.rtherm7 3 2 = 39
rtherm.rtherm8 2 tl = 55
}
COMPONENT
CTHERM6
CTHERM7
CTHERM8
RTHERM6
RTHERM7
RTHERM8
0.04 in2
1.2e-1
0.5
1.3
26
39
55
HUF76132SK8
th
JUNCTION
RTHERM1
8
RTHERM2
7
RTHERM3
6
RTHERM4
5
RTHERM5
4
RTHERM6
3
RTHERM7
2
RTHERM8
CTHERM1
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
CTHERM7
CTHERM8
tl
CASE
TABLE 1. Thermal Models
0.28 in2
0.52 in2
1.5e-1
2.0e-1
1.0
1.0
2.8
3.0
20
15
24
21
38.7
31.3
0.76 in2
2.0e-1
1.0
3.0
13
19
29.7
1.0 in2
2.0e-1
1.0
3.0
12
18
25
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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