CS493254-CL Ver la hoja de datos (PDF) - Cirrus Logic
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CS493254-CL Datasheet PDF : 90 Pages
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CS49300 Family DSP
1. CHARACTERISTICS AND SPECIFICATIONS
(All Min/Max characteristics and specifications are guaranteed over the Specified Operating Conditions. Typical
performance characteristics and specifications are derived from measurements taken at nominal supply voltages
and TA = 25°C.)
1.1. Specified Operating Conditions
(AGND, DGND = 0 V; all voltages with respect to 0 V)
DC power supplies:
Parameter
Ambient operating temperature
Symbol Min Typ Max Unit
Positive digital VD
2.37 2.5 2.63
V
Positive analog VA
2.37 2.5 2.63
V
||VA| – |VD||
-
-
0.3
V
TA
0
-
70
°C
1.2. Absolute Maximum Ratings
(AGND, DGND = 0 V; all voltages with respect to 0 V)
Parameter
DC power supplies:
Positive digital
Positive analog
||VA| – |VD||
Input current, any pin except supplies
Digital input voltage
Storage temperature
Symbol
VD
VA
Iin
VIND
Tstg
Min
– 0.3
– 0.3
-
-
– 0.3
– 65
Max
Unit
2.75
V
2.75
V
0.3
V
± 10
mA
3.63
V
150
°C
CAUTION: Operation at or beyond these limits may result in permanent damage to the device. Normal operation
is not guaranteed at these extremes.
1.3. Thermal Data
(VA, VD[3:1] = 2.5 V ±5%; measurements performed under operating conditions)
Parameter
Symbol Min
Typ
Max
Unit
Thermal Resistance (Junction to Ambient)
Two-layer Board (Note 1) θja
-
-
44.5 °C / Watt
Four-layer Board (Note 2)
-
-
36.3
Thermal Resistance (Junction to Top of Package)
Two-layer Board (Note 1) ψ jt
-
-
2.0 °C / Watt
Four-layer Board (Note 2)
-
-
3.8
Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper
covering 20 % of the top & bottom layers.
2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper
covering 20 % of the top & bottom layers and 0.5-oz copper covering 90 % of the internal power plane
& ground plane layers.
3. To calculate the die temperature for a given power dissipation
Tj = Ambient Temperature + [ (Power Dissipation in Watts) * θja ]
4. To calculate the case temperature for a given power dissipation
Tc = Tj - [ (Power Dissipation in Watts) * ψ jt ]
DS339F7
7
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