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STB100NF04L Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Lista de partido
STB100NF04L Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
STB100NF04L
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
0.5
Rthj-amb Thermal Resistance Junction-ambient
Max
62.5
Tj
Maximum Lead Temperature For Soldering Purpose
Typ
300
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
40
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
°C/W
°C/W
°C
Max.
1
10
±100
Unit
V
µA
µA
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 4.5 V
ID = 50 A
ID = 50 A
Min.
1
Typ. Max.
0.0036 0.0042
0.0040 0.0065
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 20 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
50
6400
1300
190
Max.
Unit
S
pF
pF
pF
2/9

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