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STB80NF55L-06 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Lista de partido
STB80NF55L-06 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
STB80NF55L-06 STP80NF55L-06
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
0.5
Rthj-amb Thermal Resistance Junction-ambient
Max
62.5
Tl
Maximum Lead Temperature For Soldering Purpose
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
55
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 5 V
ID = 40 A
ID = 40 A
Min.
1
Typ. Max.
0.005 0.0065
0.0055 0.008
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 40 A
VDS = 25V f = 1 MHz VGS = 0
Min.
Typ.
150
4850
1040
375
Max.
Unit
S
pF
pF
pF
2/10

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