P/N + Descripción + Búsqueda de contenido
Número de pieza(s) : AM41DL6408H AM41DL6408H70I AM41DL6408H85I AM41DL6408H71I
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : AM45DL3208G AM45DL3208GT70I AM45DL3208GB70I AM45DL3208GT85I AM45DL3208GB85I
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : DS42585
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : HY628100B HY628100B-E HY628100B-I HY628100BLG HY628100BLLG HY628100BLG-E HY628100BLLG-E HY628100BLG-I HY628100BLLG-I HY628100BLT1
Hynix Semiconductor
componentes Descripción : 128K x 8bit CMOS SRAM
Número de pieza(s) : HM628128DI HM628128DLPI-7 HM628128DLFPI-7
Hitachi -> Renesas Electronics
componentes Descripción : 1 M SRAM (128-kword × 8-bit)
Número de pieza(s) : HY628100A HY628100AG HY628100AG-55 HY628100AG-70 HY628100AG-85 HY628100ALG HY628100ALG-55 HY628100ALG-70 HY628100ALG-85 HY628100ALLG
Hyundai Micro Electronics
componentes Descripción : 128K x 8bit CMOS SRAM
Número de pieza(s) : CRIMPFOX-M-CX-1 1212087
Phoenix Contact
componentes Descripción : Replacement die - CRIMPFOX-M CX-1/DIE
Número de pieza(s) : E27 E27-09-F-B-Q-B-C-1 E27-09-F-A-Z-B-D-1 E27-09-F-A-Q-B-B-1 E27-09-F-A-Q-B-C-1 E27-25-M-G-N-B-B-1 E27-25-M-D-T-B-B-1 E27-25-M-D-P-B-B-1 E27-25-M-C-Z-B-B-1 E27-25-M-C-Q-B-B-1
DB Lectro Inc
componentes Descripción : D-SUM PCB RIGHT ANGLE (SMT) FOR NOTEBOOK
Número de pieza(s) : CL303-0007-3 CL303-0007-3(01) CL303-0011-0 CL303-0024-2 CL303-0024-2(01) CL303-0024-2(02) CL303-0025-5 CL303-0025-5(01) CL303-0025-5(02) CL303-0027-0
HIROSE ELECTRIC
componentes Descripción : RF CO-AXIAL CONNECTORS
Número de pieza(s) : DS42515
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : DS42546
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : DS42587
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : HM628128D HM628128DLP-5 HM628128DLP-7 HM628128DLP-5SL HM628128DLP-7SL HM628128DLP-5UL HM628128DLP-7UL HM628128DLFP-5 HM628128DLFP-7 HM628128DLFP-5SL
Hitachi -> Renesas Electronics
componentes Descripción : 1 M SRAM (128-kword × 8-bit)
Número de pieza(s) : DS42514
Advanced Micro Devices
componentes Descripción : Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Número de pieza(s) : CL303-0007-3 CL303-0007-3(01) CL303-0011-0 CL303-0024-2 CL303-0024-2(01) CL303-0024-2(02) CL303-0025-5 CL303-0025-5(01) CL303-0025-5(02) CL303-0027-0
Unspecified
componentes Descripción : RF CO-AXIAL CONNECTORS
Número de pieza(s) : CRIMPFOX-M-SR-6-1 1212471
Phoenix Contact
componentes Descripción : Replacement die - CRIMPFOX-M SR 6-1/DIE
Número de pieza(s) : IBIS4-6600-M-2 IBIS4-6600-M-1 IBIS4-6600 IBIS4-6600-C-1 IBIS4-6600-C-2
Cypress Semiconductor
componentes Descripción : High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor
Unspecified
componentes Descripción : 32.768kHz WATCH CRYSTAL, 8.3 x ø3.2MM CYLINDER PACKAGE
Número de pieza(s) : CY7C1482V33 CY7C1486V33 CY7C1480V33 CY7C1480V33-167AXC CY7C1480V33-200AXC
Cypress Semiconductor
componentes Descripción : 72-Mbit (2 M × 36/4 M × 18/1 M × 72) Pipelined Sync SRAM (Rev - 2011)
Cypress Semiconductor
componentes Descripción : 72-Mbit (2 M × 36/4 M × 18/1 M × 72) Pipelined Sync SRAM