P/N + Descripción + Búsqueda de contenido
Número de pieza(s) : C0202 C0303 C0404 C0505 C0606
Unspecified
componentes Descripción : Wire Bondable Chip Capacitor
Número de pieza(s) : WBC-C0606AG-102-M WBC-C0202AA-102-M WBC-C0202AA-102-K WBC-C0606AG-102-K WBC-C0202AA-102-J WBC-C0606AG-102-J
IRC - a TT electronics Company.
componentes Descripción : Wire Bondable Chip Capacitor
Número de pieza(s) : WBD-DSOT23V-470-M-470-M WBD-DSOT23V-470-K-470-M WBD-DSOT23T-470-K-470-M WBD-DSOT23T-470-M-470-M RWBD-DSOT23R-470-K-470-M WBD-DSOT23R-470-M-470-M
IRC - a TT electronics Company.
componentes Descripción : Wire Bondable Resistor/Capacitor Circuits
Número de pieza(s) : WBD-DSOT23V-470-M-470-M RWBD-DSOT23R-470-K-470-M WBD-DSOT23R-470-M-470-M WBD-DSOT23T-470-K-470-M WBD-DSOT23T-470-M-470-M WBD-DSOT23V-470-K-470-M
TT Electronics.
componentes Descripción : Wire Bondable Resistor/Capacitor Circuits
Número de pieza(s) : MXP415-C
Microsemi Corporation
componentes Descripción : Photo Transistor Chip
Número de pieza(s) : CRHV1206 CRHV1210 CRHV2010 CRHV2510 CRHV2512 CRHV1206CF5005F200S2 CRHV1206AF8205J250S2 CRHV1206CF8007K1000S CRHV2512AA5006G150S2 CRHV1206AA3507J500S2
Vishay Semiconductors
componentes Descripción : Thick Film Chip Resistors, High Voltage
Número de pieza(s) : MXP1126-C
Microsemi Corporation
componentes Descripción : Photo Transistor Chip
Número de pieza(s) : MXP18-C
Microsemi Corporation
componentes Descripción : Monolithic Photodiode Array - Chip
Número de pieza(s) : 935142521310-F1T 935142521310-F2T 935142521310-E1T 935142521310-T3T 935142521310-W0T 935146521310-F1T 935146521310-F2T 935146521310-E1T 935146521310-T3T 935146521310-W0T
Murata Manufacturing
componentes Descripción : Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 100pF BV150
Número de pieza(s) : CHIP-1310-P5
Roithner LaserTechnik GmbH
componentes Descripción : Laser Diode Bare Chip
Número de pieza(s) : 935142831510-F1T 935142831510-F2T 935142831510-E1T 935142831510-T3T 935142831510-W0T 935146831510-F1T 935146831510-F2T 935146831510-E1T 935146831510-T3T 935146831510-W0T
Murata Manufacturing
componentes Descripción : Wire Bondable vertical Silicon Capacitor WBSC/WLSC 0202 10nF BV30
Número de pieza(s) : 935142521410-F1T 935142521410-F2T 935142521410-E1T 935142521410-T3T 935142521410-W0T 935146521410-F1T 935146521410-F2T 935146521410-E1T 935146521410-T3T 935146521410-W0T
Murata Manufacturing
componentes Descripción : Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150
Número de pieza(s) : 939132425510-W0A
Murata Manufacturing
componentes Descripción : Broadband Wire Bondable / Embedding Silicon Capacitor BBEC 0201M 10nF BV11
Número de pieza(s) : CHIP-650-P5
Roithner LaserTechnik GmbH
componentes Descripción : Laser Diode Bare Chip
Número de pieza(s) : CHIP-980-P50
Roithner LaserTechnik GmbH
componentes Descripción : Laser Diode Bare Chip
Número de pieza(s) : PSC PSC3400C PSC1050B PSC1250B PSC1800B PSC4500B PSC3400CL4A1GNHW1
Vishay Semiconductors
componentes Descripción : High Frequency RF Spiral Inductor for Wire Bonded Assemblies
Número de pieza(s) : 935153831510-F1T 935153831510-F2T 935153831510-E1T 935153831510-T3T 935153831510-W0T 935154831510-F1T 935154831510-F2T 935154831510-E1T 935154831510-T3T 935154831510-W0T
Murata Manufacturing
componentes Descripción : Ultra large band Wire Bondable Silicon Capacitor UWSC 0202 10nF BV30