DESCRIPTION
The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP.
The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities and large of quantities memory are required.
This is a socket-ty pe memory module ,suitable f or easy interchange or addition of module.

FEATURES
• Utilizes industrystandard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resister in TSSOP package , and industry standard PLL in TSSOP package.
• Single 3.3V +/- 0.3V supply
• Burst length 1/2/4/8/Full Page (programmable)
• Burst type sequential / interleave (programmable)
• Column access random
• Burst W rite / Single W rite (programmable)
• Auto precharge / Auto bank precharge controlled by A10
• Auto refresh and Self refresh
• LVTTL Interface
• 4096 refresh cycles every 64ms
• Intel specifiation(rev. 1.2)compliant PCB and SPD 1.2A

APPLICATION
   Main memory unit for computers, Microcomputer memory.