ExpressLane™ PCI Express to PCI Bridge

FEATUREs
ƒ General Features
o Forward and Reverse bridging
o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm)
o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm)
o Low power – 400 milliwatts
o EEPROM configuration option with SPI
o Internal 8Kbyte shared RAM
o 1.5 V core supply voltage
o JTAG
o Four (4) GPIO pins for maximum design flexibility
o Extensive PME support including D0 and D0Active, D1, D2 and D3  Hot and D3Cold
o Lead-free packaging only
o Industrial Temperature: -40 to +85ºC