Features
● For surface mounted applications in order to optimize board space
● Low profile space
● Glass passivated chip
● Low inductance
● Excellent clamping capability
● Very fast response time
● Typical ID less than 1µA at VWM
● 200 W peak pulse power capability with a 10/1000 µs waveform
● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC