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2-6000 Hoja de datos

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American Accurate Components, Inc.

JXWBGF-T-2-6000-18000

General Power Divider (SMA Connectors)

3M

3M™ DIP Socket Stamped and Formed, Dual-Wipe

3M

3M™ DIP Socket Stamped and Formed, Dual-Wipe

Match & Start : 2-6000

Unspecified

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

NEC => Renesas Technology

Ultra-low power, compact and lightweight, High breakdown voltage, Surface mounting type

NEC => Renesas Technology

COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE

Panasonic Corporation

RM-realy. 4 GHz 2 form C microwave relay.

Panasonic Corporation

Space reduction down to footprint of 5.6 mm × 14 mm2 realized TN RELAYS

Unspecified

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

NEC => Renesas Technology

COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE

Panasonic Corporation

LOW PROFILE 2 FORM C RELAY TQ-RELAYS

Matsushita Electric Works

2 A CAPACITY RELAY WITH HIGH SURGE VOLTAGE & HIGH BREAKDOWN VOLTAGE TX RELAYS

Matsushita Electric Works

HIGH FREQUENCY RG RELAYS WITH 1C AND 2C CONTACTS - RG-RELAYS

1 2 3 4 5

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