XE2422H Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Lista de partido

XE2422H

Low-Cost, 2400 BPS Surface-Mount Modem

Unspecified 

XE2422H Surface-Mount Soldering Instructions

The XE2422H is subject to damage if overexposed to heat during solder reflow operations. Following the

soldering instructions below will ensure that the process of soldering the module to the board does not

damage the modem.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

Maximum Recommended Solder Temperature Profile

220O C

180O C

150O C

------------------------------180 sec max-------------------------

-20 sec-

max

----- 90 sec max -----

XECOM

(6)

XE2422H

Share Link: