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5962F0254301QXA Ver la hoja de datos (PDF) - Aeroflex UTMC

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5962F0254301QXA Datasheet PDF : 12 Pages
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RADIATION HARDNESS SPECIFICATIONS 1
PARAMETER
Total Dose
SEL Latchup
LIMIT
1.0E5
>113
Neutron Fluence (Note 2)
1.0E14
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Not tested, inherent to CMOS technology.
UNITS
rad(Si)
MeV-cm2 /mg
n/cm 2
ABSOLUTE MAXIMUM RATINGS1
SYMBOL
VI/O (Note 2)
VDD1
VDD2
TSTG
TJ (Note 3)
ΘJC
II
PD
PARAMETER
Voltage any pin
Supply voltage
Supply voltage
Storage Temperature range
Maximum junction temperature
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT (Mil only)
-.3 to VDD1 +.3
-0.3 to 4.0
-0.3 to 4.0
-65 to +150
+150
20
±10
1
UNITS
V
V
V
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maxim um rating conditions for extended
periods may affect device reliability and performance .
2. For Cold Spare mode (V DD1 =VSS, V DD2 =VSS), V I/O may be -0.3V to the maximum recommended operating level of VDD1 +0.3V.
3. Maximum junction temperature may be increased to +175 oC during burn-in and life test.
DUAL SUPPLY OPERATING CONDITIONS
SYMBOL
VDD1
VDD2
VIN
TC
PARAMETER
Supply voltage
Supply voltage
Input voltage any pin
Temperature range
LIMIT
2.3 to 3.6
2.3 to 3.6
0 to VDD1
-55 to + 125
UNITS
V
V
V
°C
4

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