RTL8198 Ver la hoja de datos (PDF) - Realtek Semiconductor
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RTL8198 Datasheet PDF : 86 Pages
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RTL8198
Datasheet
12. Thermal Characteristics
Heat generated by the chip causes a temperature rise of the package. If the temperature of the chip (Tj,
junction temperature) is beyond the design limits, there will be negative effects on operation and the life
of the IC package. Heat dissipation, either through a heat sink or electrical fan, is necessary to provide a
reasonable environment (Ta, ambient temperature) in a closed case. As power density increases, thermal
management becomes more critical. A method to estimate the possible Ta is outlined below.
Thermal parameters are defined as below according to JEDEC standard JESD 51-2, 51-6:
(1) θja (Thermal resistance from junction to ambient), represents resistance to heat flow from the chip to
ambient air. This is an index of heat dissipation capability. A lower θja means better thermal
performance.
θja=(Tj-Ta)/P
Where Tj is the die junction temperature, Ta is the ambient air temperature,
P is the power dissipation by device (Watts)
(2) θjc (Thermal Resistance Junction-to-Case, °C/W ), measures the heat flow resistance between the die
surface and the surface of the package (case). This data is relevant for packages used with external
heatsinks.
θjc=(Tj-Tc)/P
Where Tj is the die junction temperature, Tc is the package case temperature.
P is the power dissipation by device (Watts)
(3) Ψjt (Thermal Characterization Parameter: Junction to package top), represents the correlation between
the temperature of the chip and the package top.
Ψjt=(Tj-Tt)/P
Where Tj is the die junction temperature, Tt is the top of package temperature.
P is the power dissipation by the device (Watts)
IEEE 802.11n Gigabit Ethernet AP/Router Network Processor
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Track ID: JATR-2265-11 Rev. 0.91
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