RTL8198 Ver la hoja de datos (PDF) - Realtek Semiconductor
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RTL8198 Datasheet PDF : 86 Pages
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RTL8198
Datasheet
Thermal Terminology
The major thermal dissipation paths can be illustrated as following:
Tj: The maximum junction temperature
Ta: The ambient or environment temperature
Tc: The maximum compound surface temperature
Tb: The maximum surface temperature of PCB bottom
P: Total input power
PQFP Junction to ambient thermal resistance, θja,
defined as:
Tc
•
Ta
P
Tj
•
TJ - TA
θJA = P
Tb
Ta
•
Thermal Dissipation of PQFP Package
12.1. Thermal Operating Range
Table 90. Thermal Operating Range
Parameter
SYM Condition
Min Typ. Max Units
Junction Operating Temperature Tj -
0
- 125 °C
Ambient Operating Temperature Ta 4-layer FR4 PCB (without heat sink)
0
25 65 °C
Note: PCB conditions (JEDEC JESD51-7). Dimensions: 120mm x 90mm. Thickness: 1.6 mm.
12.2. Thermal Parameters
Table 91. Thermal Parameters
Parameter
SYM
Condition
Air Air
Flow Flow
0 m/s 1 m/s
Thermal Resistance: Junction to Ambient
θja 2-layer FR4 PCB 18.5 14.9
Thermal Resistance: Junction to Ambient
θja 4-layer FR4 PCB 13.8 10.7
Thermal Characterization: Junction to Package Top Ψjt 2-layer FR4 PCB 2.1 2.4
Thermal Characterization: Junction to Package Top Ψjt 4-layer FR4 PCB 1.7 1.9
Note: PCB conditions (JEDEC JESD51-7). Dimensions: 120mm x 90mm. Thickness: 1.6mm.
Air
Flow
2 m/s
13.9
9.7
2.7
2.3
Air
Flow
3 m/s
13.2
9.3
3.4
2.8
Units
°C/W
°C/W
°C/W
°C/W
IEEE 802.11n Gigabit Ethernet AP/Router Network Processor
76
Track ID: JATR-2265-11 Rev. 0.91
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