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HFBR-5103A

100 Mbps ATM, and Fast Ethernet Transceivers in Low Cost 1x9 Package Style

HP => Agilent Technologies 

ATM applications for physical

layers other than 100 Mbps

Multimode Fiber Interface are

supported by Agilent. Products

are available for both the single

mode and the multimode fiber

SONET-OC-3C (STS-3C) ATM

interface and the 155 Mbps ATM

94 MBd multimode fiber ATM

interface as specified in the ATM

Forum UNI.

Transmitter Sections

The transmitter sections of the

HFBR-5103 series utilize 1300 nm

Surface Emitting InGaAsP LEDs.

These LEDs are packaged in the

optical subassembly portion of

the transmitter section. They are

driven by a custom silicon IC

which converts differential PECL

logic signals, ECL referenced

(shifted) to a +5 Volt supply, into

an analog LED drive current.

Receiver Sections

The receiver sections of the

HFBR-5103 series utilize InGaAs

PIN photodiodes coupled to a

custom silicon transimpedance

preamplifier IC. These are

packaged in the optical

subassembly portion of the

receiver.

These PIN/preamplifier

combinations are coupled to a

custom quantizer IC which

provides the final pulse shaping

for the logic output and the Signal

Detect function. The data output

is differential. The signal detect

output is single-ended. Both data

and signal detect outputs are

PECL compatible, ECL referenced

(shifted) to a +5 Volt power

supply.

Package

The overall package concept for

the Agilent transceivers consists

of the following basic elements;

two optical subassemblies, an

electrical subassembly and the

housing as illustrated in Figure 1

and Figure 1a.

Figure 2b shows the outline

drawing for options that include

mezzanine height with extended

shield.

The package outline drawing and

pin out are shown in Figures 2, 2a

and 3. The details of this package

outline and pin out are compliant

with the multisource definition of

the 1x9 SIP. The low profile of the

Agilent transceiver design

complies with the maximum

height allowed for the duplex SC

connector over the entire length

of the package.

The optical subassemblies utilize

a high volume assembly process

together with low cost lens

elements which result in a cost

effective building block.

The electrical subassembly

consists of a high volume

multilayer printed circuit board

on which the IC chips and various

surface-mounted passive circuit

elements are attached.

The package includes internal

shields for the electrical and

optical subassemblies to ensure

low EMI emissions and high

immunity to external EMI fields.

The outer housing including the

duplex SC connector receptacle

or the duplex ST ports is molded

of filled non-conductive plastic to

provide mechanical strength and

electrical isolation. The solder

posts of the Agilent design are

isolated from the circuit design of

the transceiver and do not require

connection to a ground plane on

the circuit board.

The transceiver is attached to a

printed circuit board with the nine

signal pins and the two solder

posts which exit the bottom of the

housing. The two solder posts

provide the primary mechanical

strength to withstand the loads

imposed on the transceiver by

mating with duplex or simplex SC

or ST connectored fiber cables.

DIFFERENTIAL

DATA OUT

SINGLE-ENDED

SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

QUANTIZER IC

PREAMP IC

DUPLEX SC

RECEPTACLE

PIN PHOTODIODE

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

DATA IN

DRIVER IC

LED

TOP VIEW

Figure 1. SC Block Diagram

2

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