SC18IS600(2006) Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Lista de partido
SC18IS600 Datasheet PDF : 28 Pages
| |||
NXP Semiconductors
SC18IS600/601
SPI to I2C-bus interface
6.6.9 Power-down mode
SPI host sends
0x30
COMMAND
0x5A
0xA5
CS
SCLK
MOSI
character 0x30
character 0x5A
character 0xA5
002aab725
Fig 20. Power-down mode
The SC18IS600/601 can be placed in a low-power mode where the internal oscillator is
stopped and it will no longer respond to SPI messages. Enter the Power-down mode by
sending the power-down command (0x30) followed by the two defined bytes, which are
0x5A followed by 0xA5. If the exact message is not received, the device will not enter the
power-down state.
Before entering the power-down state, WAKEUP/IO4 should be placed in a HIGH state.
To exit the power-down state, the WAKEUP/IO4 should be brought LOW. After leaving the
power-down state, the WAKEUP/IO4 can once again be used as a general-purpose IO
pin.
7. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2]
Symbol Parameter
Conditions
Tamb(bias)
Tstg
Vn
IOH(I/O)
IOL(I/O)
II/O(tot)(max)
Ptot/pack
bias ambient temperature
storage temperature
voltage on any other pin
HIGH-state output current per input/output pin
LOW-state output current per input/output pin
maximum total I/O current
total power dissipation per package
operating
referenced to VSS
Min
−55
−65
−0.5
-
-
-
[3] -
Max
Unit
+125
°C
+150
°C
+5.5
V
8
mA
20
mA
120
mA
1.5
W
[1] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
[2] Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[3] Based on package heat transfer, not device power consumption.
SC18IS600_601_3
Product data sheet
Rev. 03 — 13 December 2006
© NXP B.V. 2006. All rights reserved.
16 of 28
Share Link: 