STPS30170DJF Ver la hoja de datos (PDF) - STMicroelectronics
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STPS30170DJF Datasheet PDF : 9 Pages
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STPS30170DJF
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
PowerFLAT™ 5x6 package information
• Epoxy meets UL 94,V0
• Cooling method: by conduction (C)
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
Bottom view
Side view
Top view
DS6587 - Rev 5
page 5/9
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