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L6376D Ver la hoja de datos (PDF) - STMicroelectronics

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L6376D Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
L6376
12 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Table 6.
Dim.
A
a1
a2
a3
b
c
D (1)
D1 (2)
E
e
e3
E1 (1)
E2
E3
G
H
h
L
N
S
T
PowerSO-20 mechanical data
mm
Min
Typ
Max
Min
3.6
0.1
0.3
0.004
3.3
0
0.1
0.000
0.4
0.53
0.016
0.23
0.32
0.009
15.8
16
0.622
9.4
9.8
0.370
13.9
14.5
0.547
1.27
11.43
10.9
11.1
0.429
2.9
5.8
6.2
0.228
0
0.1
0.000
15.5
15.9
0.610
1.1
0.8
1.1
0.031
8°(typ.)
8°(max. )
10
inch
Typ
0.050
0.450
0.394
Max
0.142
0.012
0.130
0.004
0.021
0.013
0.630
0.386
0.570
0.437
0.114
0.244
0.004
0.626
0.043
0.043
15/18

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