TQ8025 Ver la hoja de datos (PDF) - TriQuint Semiconductor
Número de pieza
componentes Descripción
Lista de partido
TQ8025 Datasheet PDF : 10 Pages
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TQ8025
PRELIMINARY DATA SHEET
Figure 5. Mechanical Dimensions
Bottom view
Top view
PIN 1
INDEX
1
1.170 +.006
.950 +.006
.800
132
CERAMIC OR
A
A
METAL LID
0.325
± .005
.025
CHIP CAPACITOR, 4 PLACES
Section A-A
.060
HEAT SPREADER
.125
DEVICE
SEATING PLANE
.064
Ordering Information
.010 +.0015
BSC
1. Part is symmetrical about the center axes.
2. Centerline bisects center pin in both directions.
3. See pad detail below.
0.025
centers
CL
0.015
0.010
0.525
CL
0.105
PAD LAYOUT DETAIL
TQ8025
2.5 Gb/s 16x16 Crosspoint Switch
Additional Information
For latest specifications, additional product information,
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Web: www.triquint.com Tel: (503) 615-9000
Email: sales@tqs.com Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: applications@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or
ommisions. TriQuint assumes no responsibility for the use of this information, and all such information
shall be entirely at the user's own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1998 TriQuint Semiconductor, Inc. All rights reserved.
Revision 0.3.A August 1998
10
For additional information and latest specifications, see our website: www.triquint.com
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