XE2420 Ver la hoja de datos (PDF) - Xecom

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XE2420

2400 BPS Surface-Mountable Integrated Sealed-Hybrid Modem

Xecom 

XE2420 Soldering Instructions

The XE2420 is subject to damage if over-exposed to heat during solder reflow operations. Following the

soldering instructions below will ensure that the process of soldering the module to the board does not damage the

modem. The XE2420 must not be exposed to direct Infrared (IR) heating. If your process includes direct IR

heating, you must shield the XE2420 from the infrared rays.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

220O C

180O C

150O C

Maximum Recommended Solder Temperature Profile

--------------------------------180 sec max ---------------------

-20 sec-

max

----- 90 sec max -----

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XE2420

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